Designcon 2018 演讲资料免费下载

Designcon 2018 演讲资料免费下载

一年一度的全球高速设计盛会Designcon 2018圆满落幕，Cadence与思科、富士康、英特尔等客户的演讲资料已开放，干货满满，快来下载哦！

Ken Willis, Product Engineering Architect,Cadence发表演讲

演讲资料大纲：

- Reduction of Mode Conversion in SerDes Links

• Performance Analysis for Next-Generation PCIeInterface
• Backchannel Modeling and Simulation Using RecentEnhancements to the IBIS Standard
• Temperatureand Geometry-Dependent Analysis ofHigh-Speed PCB Traces
• DDR-4400 IP Model Development Using AMI Builder
• Advanced IC Packaging Trends and Their Impact onEDA Tools
• HSSO Physical Structure Optimization forHigh-Speed Interconnects
• Brand-New Electrical and Thermal Co-SimulationAnalysis
• A New Platform Power Integrity Design Approachwith SPIM and UPIT
• DDR5 Modeling Using Automated IBIS-AMI ModelingTechnology
  
  

下载链接：https://www.cadence.com/content/cadence-www/global/enUS/home/company/events/industry-events/designcon-2018.html©CMP=NAINT_EMMKTO0218